0.671W / for M K Thermal Compound High Performance Thermal Grease for CPU Coolers GPU Processor Ovens Chipset Cooli Notebook Cooling Fan Internal Notebook Stand Heatsinks for CPU Internal

0.671W / for m K Thermal Compound High Performance Thermal Grease for CPU Coolers GPU Processor Ovens Chipset Cooli 2Pcs Heatsink Plaster Thermal Silicone Adhesive Cooling Compound Features: 1 It has good conductivity and wide service temperature range ( 60~200℃), short term 300℃ high temperature 2 The surface curing for time is short, the adhesive force is strong, the storage period is long, and solvent free 3 It can be applied safely in elastic adhesion, heat dissipation, insulation and encapsulation in electronics, electrical appliances, instruments, LED, heat sinks and other industries 4 It is suitable for all kinds of components, LED and heat dissipation devices which need to be bonded directly It has high strength and fast adhesion effect Specifications: Color: White Weight: approx 10g Adhesive type: memory.MOSFET heat sink fin heat sink North and South Bridge Hot melt adhesive type: other Shear strength: 1.5 () Active use period: 10 ( min) Solidification time: 3min 25°C Thermal conductivity: >0.671W / for m.k Surface curing time: 10MIN / 25℃ Length: 5.5cm （ 2.17in） Quantity: 2Pcs Manual: 1 When it is used, the product is directly extruded, rubbed and glued to the surface of the adhesive, and then covered immediately after the, so as to be tried again 2 The surface fixed speed is related to the relative humidity and temperature in the air; the higher the temperature, the faster the curing rate is, the slower the 3 Recommended coating thickness: 0.1-0.5mm, the thinner the better 4 Before use, please with solvent ( such as) adhesive surface, detergents should be surface to be before painting Note: Please allow 1-3 for cm differs due to manual measurement Due to the diff

• The surface curing time is short, the adhesive force is strong, the storage period is long, and solvent free
• It is suitable for all kinds of components, LED and heat dissipation devices which need to be bonded directly It has high strength and fast adhesion effect
• It can be applied safely in elastic adhesion, heat dissipation, insulation and encapsulation in electronics, electrical appliances, instruments, LED, heat sinks and other industries
• Adhesive type: memory.MOSFET heat sink fin heat sink North and South Bridge
• It has good conductivity and wide service temperature range ( 60~200℃), short term 300℃ high temperature