2 Pieces Silicone Thermal Grease Compound 0.671W/for M.K for Processor CPU GPU Radiator Graphics Card Cooli Laptop CPU Cooling Fan Heatsink Radiator Holder Base Bracket Case Rack

2Pcs Performance Silicone Thermal Grease 0.671W/for M. K For For CPU Heatsink Fan Cooling VGA Compo2Pcs Heatsink Thermal Silicone Adhesive Cooling Compound Features: 1. It has good conductivity and wide service temperature range(-60200℃), short term 300℃ temperature. 2. The surface curing for time is short, the adhesive force is strong, the storage period is long, and solvent free. 3. It can be applied safely in elastic adhesion, heat dissipation, insulation and encapsulation in electronics, electrical appliances, instruments, LED, heat sinks and other industries. 4. It is suitable for all kinds of components, LED and heat dissipation devices which need to be bonded directly. It has strength and fast adhesion effect. Specifications:Color: White Weight: approx. 10g Adhesive Material type: memory.MOSFET heat sink fin heat sink. North and South Bridge Hot melt adhesive type: other Shear strength: 1.5 Active use period: 10 (min) Solidification time: 3min 25C Thermal conductivity: >0.671W/for m.k Surface curing time: 10MIN/25℃ Length :5.5cm（2.17in） Quantity: 2Pcs Manual: 1. When it is used, the product is directly extruded, rubbed and glued to the surface of the adhesive, and then covered immediately after the test, so as to be tried again. 2. The surface fixed speed is related to the relative humidity and temperature in the air; the higher the temperature, the faster the curing rate is, the slower the 3. Recommended coating thickness: 0.1-0.5mm, the thinner the better. 4. Before use, please clean with solvent (such as adhesive surface, detergents should be surface to be clean before painting. Note:Please allow 1-3 for cm differs due to manual measurement. Due to the diff

• The surface curing time is short, the adhesive force is strong, the storage period is long, and solvent free.
• It can be applied safely in elastic adhesion, heat dissipation, insulation and encapsulation in electronics, electrical appliances, instruments, LED, heat sinks and other industries.
• Adhesive Material type: memory.MOSFET heat sink fin heat sink. North and South Bridge
• It is suitable for all kinds of components, LED and heat dissipation devices which need to be bonded directly. It has strength and fast adhesion effect.
• It has good conductivity and wide service temperature range(-60~200℃), short term 300℃ temperature.